Abstract: During the last several years, 3D printing has been receiving significant attention in academia and has also generated business interests. To many, 3D printing is a transformative technology capable of impacting many areas of experimental Science, of Engineering, of Medicine, development of robotic hands, tissue engineering and personalized (i.e., one-of-a-kind) items for the emerging Industry 4.0 etc. So far, the 3D printing technology has been focused on printing of single material (i.e. either plastic or metal). Recently there has been some progress towards multi-material 3D printing i.e. printing conductive material and plastic simultaneously. This lecture will cover various aspects related to basis 3D printing technology as well as the new developments such as multi-material 3D printing.

Bio: Ravinder Dahiya is Professor of Electronics and Nanoengineering and Engineering and Physical Sciences Research Council (EPSRC) Fellow in the School of Engineering at University of Glasgow. He is the Director of Electronic Systems Design Centre (ESDC) and the leader of Bendable Electronics and Sensing Technologies (BEST) group. His group conducts fundamental research on high-mobility materials based flexible electronics and electronic skin, and their application in robotics, prosthetics and wearable systems.

Prof. Dahiya has published more than 250 research articles, 4 books (3 at various publication stages), and 12 patents (including 7 submitted). He has given more than 110 invited/plenary talks. He has led many international projects (> £20M) funded by European Commission, EPSRC, The Royal Society, The Royal Academy of Engineering, and The Scottish Funding Council.

He is President-Elect and Distinguished Lecturer of IEEE Sensors Council and is on the Editorial Boards of Scientific Reports (Nature Group), and IEEE Sensors Journal. He is also the editor of Cambridge Elements on Flexible and Large Area Electronics. He was the Technical Program Co-Chair (TPC) for IEEE Sensors Conference in 2017 and 2018. He is the General Chair of 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (IEEE FLEPS) and IEEE ICECS 2019.

Prof. Dahiya holds EPSRC Fellowship and in past he received Marie Curie Fellowship and Japanese Monbusho Fellowship. He has received several awards and most recent among them are: 2018 Elektra award for best university research in the UK, 2016 IEEE Sensor Council Technical Achievement Award, the 2016 Microelectronic Engineering Young Investigator Award (Elsevier) and 2016 Scottish 40UNDER40.