Abstract of the talk: During the last several years, 3D printing has been receiving significant attention in academia and has also generated business interests. To many, 3D printing is a transformative technology capable of impacting many areas of experimental Science, of Engineering, of Medicine, development of robotic hands, tissue engineering and personalized (i.e., one-of-a-kind) items for the emerging Industry 4.0 etc. So far, the 3D printing technology has been focused on printing of single material (i.e. either plastic or metal). Recently there has been some progress towards multi-material 3D printing i.e. printing conductive material and plastic simultaneously. This lecture will cover various aspects related to basis 3D printing technology as well as the new developments such as multi-material 3D printing.
Participants: 137 (mostly students and faculty of Marwadi University)
IEEE Member/Non-member: No data
Registration fee: free
Speaker: Prof. Ravinder Dahiya
DL Talk organized by: Sensors Council Chapter, IEEE Gujarat Section
Affiliation: Professor of Electronics and Nanoengineering, University of Glasgow
Duration: 4:00 – 5:00 PM
Venue: Auditorium hall, Marwadi University, Rajkot
Bio: Prof. Dahiya is the Director of Electronic Systems Design Centre (ESDC) and the leader of Bendable Electronics and Sensing Technologies (BEST) group which is involved in fundamental research on high-mobility materials based flexible electronics and electronic skin, and their application in robotics, prosthetics and wearable systems. Prof. Dahiya has published more than 250 research articles, 4 books (3 at various publication stages), and 12 patents (including 7 submitted). He has given more than 110 invited/plenary talks. He has led many international projects funded by European Commission, EPSRC, The Royal Society, The Royal Academy of Engineering, and The Scottish Funding Council. He is President-Elect and Distinguished Lecturer of IEEE Sensors Council and is on the Editorial Boards of Scientific Reports (Nature Group), and IEEE Sensors Journal.