Bio: Ravinder Dahiya is Professor of Electronics and Nanoengineering and Engineering and Physical Sciences Research Council (EPSRC) Fellow in the School of Engineering at University of Glasgow. He is the Director of Electronic Systems Design Centre (ESDC) and the leader of Bendable Electronics and Sensing Technologies (BEST) group. His group conducts fundamental research on high-mobility materials based flexible electronics and electronic skin, and their application in robotics, prosthetics and wearable systems.
Prof. Dahiya has published more than 250 research articles, 4 books (3 at various publication stages), and 12 patents (including 7 submitted). He has given more than 110 invited/plenary talks. He has led many international projects (> £20M) funded by European Commission, EPSRC, The Royal Society, The Royal Academy of Engineering, and The Scottish Funding Council.
He is President-Elect and Distinguished Lecturer of IEEE Sensors Council and is on the Editorial Boards of Scientific Reports (Nature Group), and IEEE Sensors Journal. He is also the editor of Cambridge Elements on Flexible and Large Area Electronics. He was the Technical Program Co-Chair (TPC) for IEEE Sensors Conference in 2017 and 2018. He is the General Chair of 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (IEEE FLEPS) and IEEE ICECS 2019.
Prof. Dahiya holds EPSRC Fellowship and in past he received Marie Curie Fellowship and Japanese Monbusho Fellowship. He has received several awards and most recent among them are: 2018 Elektra award for best university research in the UK, 2016 IEEE Sensor Council Technical Achievement Award, the 2016 Microelectronic Engineering Young Investigator Award (Elsevier) and 2016 Scottish 40UNDER40.
The miniaturization led advances in microelectronics over 50 years have revolutionized our lives through fast computing and communication. Recent advances in the field are propelled by applications such as robotics, wearable systems, and healthcare etc. through More than Moore technologies. Often these applications require electronics to conform to 3D surfaces and this calls for new methods to realize devices and circuits on unconventional substrates such as plastics and paper. This lecture will present various approaches (over different time and dimension scales) for obtaining distributed electronics and sensing components on soft and flexible substrates, especially in context with tactile or electronic skin (eSkin). These approaches range from distributed off-the-shelf electronics, integrated on flexible printed circuit boards to advanced alternatives such as e-skin by printed nanowires, graphene and ultra-thin chips, etc. The energy autonomy and large data handling are other critical factors that require attention for the effective use of eSkin. This lecture will also present the recent advances in this direction through energy autonomous and neuromorphic eSkin.